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Аbout GlobalFoundries GlobalFoundries (GF) is a leading full-service semiconductor foundry providing a unique combination of design, development, and fabrication services to some of the world’s most inspired technology companies. With a global manufacturing footprint spanning three continents, GF makes possible the technologies and systems that transform industries and give customers the power to shape their markets. For more information, visit  www.gf.com . Responsibilities • Develop, document, and maintain RTL (SystemVerilog/Verilog) for digital subsystems within the CPO product, including control logic, register interfaces, link management, and DFT structures. • Collaborate with architecture, analog/mixed-signal, and photonics teams to define digital interfaces and control schemes for co-packaged optical modules. • Own micro-architecture specifications, design reviews, and integration of digital IP into the top-level SoC. • Drive synthesis, timing closure, CDC, lint, and low-power (UPF) sign-off in coordination with the physical design team. • Perform FPGA prototyping and testing of digital subsystems to validate functionality, accelerate pre-silicon software bring-up, and de-risk RTL ahead of tape-out. • Develop and execute UVM-based testing, including building reusable verification components, writing constrained-random tests, and driving functional and code coverage closure. • Support verification efforts by collaborating with the DV team on testbench development, coverage closure, and debug. • Participate in tape-out readiness activities, including ECO planning, gate-level simulation, and post-silicon bring-up support. • Contribute to design methodology, reuse strategy, and quality improvements across the team. Required Qualifications • Bachelor's or Master's degree in Electrical Engineering, Computer Engineering, or related field. • 1+ years of experience in digital RTL design using SystemVerilog/Verilog. • Solid understanding of digital design fundamentals: synchronous design, CDC, FSMs, pipelining, and low-power techniques. • Hands-on experience with industry EDA tools (synthesis, lint, CDC, simulation). • Familiarity with scripting (Python, TCL, Perl) for design automation. • Strong problem-solving skills and ability to work in a cross-functional team. Preferred Qualifications • Experience with high-speed serial interfaces (SerDes, PCIe, Ethernet, CXL) or optical link control. • Exposure to silicon photonics, co-packaged optics, or advanced packaging products. • Experience with ARM-based SoC integration, AMBA protocols (AXI/AHB/APB), and standard IP integration flows. • Prior tape-out experience on advanced process nodes. • Knowledge of UPF/low-power flows and DFT (scan, MBIST, boundary scan). We Offer • Base Salary • Equity • Annual Bonus Plan • Medical Insurance Information about our benefits you can find here: https://gf.com/careers/opportunities-in-europe/