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Skydio is the leading US drone company and the world leader in autonomous flight, the key technology for the future of drones and aerial mobility. The Skydio team combines deep expertise in artificial intelligence, best-in-class hardware and software product development, operational excellence, and customer obsession to empower a broader, more diverse audience of drone users, from utility inspectors https://www.skydio.com/solutions/energy-and-utilities to first responders https://www.skydio.com/solutions/public-safety, soldiers in battlefield scenarios https://www.skydio.com/solutions/national-security/tactical-isr, and beyond https://www.skydio.com/solutions. About the role: We are seeking a talented multi-disciplinary quality engineer to define, implement, and continuously improve quality processes. In this role, your contributions will directly drive product quality, speed to market, productivity, and profitability. POSITION SUMMARY We are seeking a highly motivated and detail-oriented Failure Analysis Engineer to investigate, diagnose, and resolve failures in drone systems and subsystems. The ideal candidate will possess strong expertise in electrical, electronic, and electromechanical components, including PCBs, power electronics, batteries, cameras, sensors, communication modules, motors, ESCs, GPS, IMUs, and embedded systems. The role involves performing systematic root cause analysis, collaborating with cross-functional teams, driving corrective and preventive actions (CAPA), and improving product reliability throughout the product lifecycle. KEY RESPONSIBILITIES FAILURE INVESTIGATION & ROOT CAUSE ANALYSIS - Perform detailed failure analysis on returned products, manufacturing defects, field failures, and reliability test failures. - Investigate failures related to: - Printed Circuit Boards (PCB/PCBA) - Power distribution systems - Battery Management Systems (BMS) - Electronic Speed Controllers (ESC) - Brushless DC motors - Cameras and imaging systems - Vision modules - GPS modules - IMU (Accelerometer, Gyroscope, Magnetometer) - Barometers and other environmental sensors - RF communication modules - Flight controllers - Wiring harnesses and connectors - Electromechanical assemblies - Conduct systematic root cause analysis using methodologies such as: - 8D - 5 Why - Fishbone Diagram - Fault Tree Analysis (FTA) - Failure Mode and Effects Analysis (FMEA) - Pareto Analysis DIAGNOSTIC & TEST ACTIVITIES - Develop and execute diagnostic procedures for failed products. - Perform electrical measurements using: - Oscilloscope - Digital Multimeter - Logic Analyzer - Spectrum Analyzer (preferred) - Power Analyzer - Thermal Camera - Interpret circuit schematics, PCB layouts, and wiring diagrams. - Conduct functional, environmental, and stress testing to reproduce failures. RELIABILITY & CORRECTIVE ACTIONS - Identify failure trends using field and production data. - Recommend design improvements to enhance product reliability. - Drive corrective and preventive actions (CAPA) with Design, Manufacturing, Supplier Quality, and Production teams. - Verify effectiveness of implemented corrective actions. COMPONENT & ASSEMBLY ANALYSIS - Analyze component-level failures including: - ICs - MOSFETs - Voltage regulators - Capacitors - Inductors - Sensors - Connectors - Cameras - RF modules - Evaluate solder joint quality, PCB defects, ESD damage, overheating, corrosion, vibration damage, and mechanical failures. DOCUMENTATION & REPORTING - Prepare comprehensive failure analysis reports with: - Root cause - Evidence - Corrective actions - Preventive actions - Risk assessment - Maintain failure databases and reliabilit