Job Opportunities API

About the role • We are seeking an experienced engineering lead in device packaging, module mechanical assembly, PCBA and device test engineering leader with degree in Electrical Engineering, Photonics, Mechanical Engineer, or a related field. What you'll do • Lead Asia operation team working with OSATs, assembly   houses, PCBA lines to support NPI and volume production. • Working closely with HQ   RnD   and operation team to implement wafer level probe   tests   at OSATs to   identify   known good dies. • Working with HQ team to support device packaging process improvement with Cp and   Cpk   increase. • Work with HQ teams and our IIIV foundries to support wafer level process, bar level, and CoC process as well as CoC level test and qualification before and after   burnin. • Work with HQ teams and our assembly houses to support module assembly and PCBA for NPI and volume production. • Work with reliability engineers to implement the tests needed for wafer, devices, packaged devices, and system   reliability tests. • Write technical documentation for test implementation,   reports,   and present results to internal and external stakeholders. • Intime make technical and project decision. • Participate in the process FMEA, process FA, and push to get 8D reports from contract manufactures • Manage and expand the Asia operation team when needed. Required Qualifications • Minimal requirement is a bachelor's degree with   12 years   of experience. • Device test knowledge and experience for at least some following areas for: IIIV   CoC,   wafer level probe test, packaged electro-optical devices, assembly modules, PCBA. • Knowledge and experience   in   at least some following processes: IIIV or CMOS wafer level process; IIIV bar level processes; device packaging processes such as die attach, flip chip, wire bonding, and module mechanical assembly processes, particularly camera and lidar module   assembly. • A fast   learner is   a must. • Good work   ethics and   maintaining   the company’s   confidential information are   a must. Preferred Qualifications • A higher   degree with more experience is highly desired. • Experience on optoelectronic device   tests   such as those for optical engines in pluggable modes and pluggable   modules   is a plus. • Experience and knowledge of   silicon   photonic devices and IIIV CoC reliability is a huge plus. • Experience of the setup and implementation of tests for NPI and volume production is a big plus. • Experience   in   the   process of   automation   and test automation is a plus. • Data analysis experience such as JMPs is a plus; Benefits (subject to location and local regulations) • Competitive salary and equity • Comprehensive medical, dental, and vision coverage • 401(k) retirement plan • Flexible vacation and time-off policy • Collaborative, fast-paced, and inclusive work environment • Opportunity to work on cutting-edge technologies with a highly cross-functional team About Lyte Lyte builds perception systems for Physical AI operating in complex environments. The company combines custom silicon, integrated sensors, and software into a unified platform for robotics, mobility, and next-generation automation. Lyte is headquartered in Sunnyvale, California, with a global presence. For more information, visit www.lyte.ai If you’re excited about building impactful technology in a dynamic, hands-on environment, we’d love to hear from you!