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Packaging Design and SI/PI Engineer

lyte
Companylyte
CategoryEngineering
LocationBucharest, Romania
Remote
EmploymentNot stated
LevelNot stated
SalaryNot stated by the employer
First seen14 Jul 2026 (the employer did not state a posting date)
Last verified9 Aug 2026
SourceEmployer ATS (rippling)
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Description
About the role • We are seeking a middle to senior level packaging design and signal/power integrity Engineer with degree in Electrical Engineering, or a related field. What you'll do • Own the design and layout of our micro-electronic package, the heart of our LyteCore system • Collaborate with multi-disciplinary team of engineers (silicon, photonics, system, operations) to define physical and electrical performance specifications for the package • Perform signal/power integrity simulation to optimize our package & system performance • Work with our substrate/package vendors to ensure design for manufacturability and support delivery of our design on time. Work with said vendors to define high volume price target. • Project tracking weekly. • Write technical reports and present results. • Maintain EDA tools and actively project future needs, including improving design flow definition and recommending EDA envelope. Required Qualifications • Minimal requirement is a bachelor's degree with 5 years of experience • Fluent in English communication, able to collaborate with teammates in different time zones • Experience in substrate design and packaging technology • Experience in signal and power integration simulation and interpretation of the results • Experience in EDA tools: Siwave, HFSS, APD, or similar • Maintain company confidential information are a must Preferred Qualifications • Master’s degree with more experience is highly desired • Proactive member of the multi-disciplinary team, takes ownership of technical challenges and work with others to resolve issues • Experience with hands-on testing of electronic packages/systems. • Knowledge and experience in at least some following processes: device packaging processes such as die attach, flip chip, wire bonding, and module mechanical assembly processes, particularly camera and lidar module assembly. • Experience in other EDA tools such as Altium, Allegro PCB, Spectre, Hspice, Sigrity, ADS. • Data analysis experience such as JMPs is a plus; excel is OK. • Programming and software maintenance skills are desired eg. python, or C++ • Describe the experience and attributes of the ideal candidate Benefits (subject to location and local regulations) • Competitive salary and equity • Comprehensive medical, dental, and vision coverage • 401(k) retirement plan • Flexible vacation and time-off policy • Collaborative, fast-paced, and inclusive work environment • Opportunity to work on cutting-edge technologies with a highly cross-functional team • About Lyte Lyte builds perception systems for Physical AI operating in complex environments. The company combines custom silicon, integrated sensors, and software into a unified platform for robotics, mobility, and next-generation automation. Lyte is headquartered in Sunnyvale, California, with a global presence. For more information, visit www.lyte.ai If you’re excited about building impactful technology in a dynamic, hands-on environment, we’d love to hear from you!