Job Opportunities API

At Kandou , we are redefining the economics of AI infrastructure. Our mission is to democratise AI by significantly reducing the Total Cost of Ownership (TCO) of hardware systems — a critical barrier to scalable adoption. Our proprietary MIMO-over-copper technology powers a high-performance, chiplet-based AI memory fabric that is both scalable and energy-efficient . Unlike traditional interconnects, our solution reduces power consumption significantly while preserving high bandwidth and ultra-low latency — unlocking unprecedented efficiency for AI training and inference at scale. Kandou’s architecture is not just an incremental improvement — it’s a foundational shift in how AI hardware is built for the future. We are actively seeking a System Architect based in US (Bay Area or Austin preferred), EU considered. • Own the SoC and Product Specification stack for a 1.6T retimer SoC and the AEC product it enables, at 224G/lane PAM4. • You will author and maintain normative specifications (SHALL/MUST/SHOULD/MAY language with REQ-ID traceability) that RTL, firmware, software, SI/PI, manufacturing, qualification, and customer engineering teams execute against. • Standards scope spans IEEE 802.3ck/dj, OIF CEI-112G/224G, OSFP MSA, CMIS 5.x, EIA-364, JEDEC JESD22/51. • You will represent architecture in hyperscaler and strategic platform customer specification negotiation, including qualification test point, FEC telemetry, CMIS vendor-page, and thermal envelope commitments. Required: • 12+ years in shipping high-speed interconnect (retimer, gearbox, PHY, AEC, AOC, coherent optics, SerDes-centric networking silicon). • Prior System Architect, Chief Architect, or Principal Systems Engineer role on a shipping 100G/lane or higher product. • Direct authorship of at least one product spec and one silicon spec on a shipping product. • PAM4 link training, FEC, and on-die telemetry fluency at the specification level. • DOORS / JAMA / equivalent traceability tooling.