Job Opportunities API

About the role • We are seeking an experienced process lead engineer in the field of optical device packaging and assembly with a degree in Mechanical Engineering, Physics or a related field. What you'll do • Lead optical engine and system module assembly with automation and tooling designs to increase UPH & yield and reduce cost with both customized hardware and software development based on SPC and drive   Cp,   Cpk   improvement. • Support the device packaging   RnD   and NPI with mechanical design, drawing and thermal modelling. • Support device   testing   automation and data analysis automation/scripts or software development and implementation. • Work with   RnD   to understand the device specs, particularly mechanical control outline, and assembly requirements and   negotiate between the incoming device MCO, mechanical design, and assembly process based on design improvement and/or experimental data from designed DOEs. • Work with   OSATs to   support NPI and volume production contract manufacture with technical SOW drafting. • Act as the technical project manager for owned projects. • Provide DFM, DFR, and DFT   inputs for HQ   RnD   teams for device packaging and assembly. • Keep proper documentation, and initiate   ECN and   PCN when needed. • Develop and   track   packaging and   assembly   component   specifications   as well as inventory. • Audit/regularly visit our contract Manufacturers and suppliers then provide reports. • Write   technical reports and present results to internal and external stakeholders. • Build and grow the Operation Process Team worldwide. Required Qualifications • Have   a mechanical   engineer   degree with relevant experience   on   optical module and/or Lider assembly. • Minimal requirement is a Master or Ph.D. degree with 3 years of relevant experience. • Experience or knowledge of optical   sensors. optical device packaging process, or optical module assembly process. • Experience with assembly process integration for process flow design and continue process improvement. • Expertise   mechanical drawings   using   SolidWork, mechanical simulation, and thermal simulation. • Project management capability/experience is   a must. • Experience working with foundries, OSATs, assembly   houses, PCBA   fab, and contract manufacturers in process development and yield improvement is important. • The ability   to work independently and take ownership of projects as well as collaboratively in cross-functional teams   is a must. • A fast   learner is   a must. • Good work   ethics is   a must • Capable   of   keeping company confidential information and IP is a must. Preferred Qualifications • Knowledge or work experience with   PCBA   is highly desirable. • Former experience of microelectronic and optical devices packaging is   desired. • Understanding Silicon Photonics is a plus. • Experience with FMEA, failure analysis, and 8D report is highly desired. • Supplier quality management experience is a plus. • Knowledge of Lidar and relevant technologies is a plus. • Former experience of writing technical SoW is a plus. • Familiar with ECN,   PCN,   and documentation   is   highly desirable. Benefits • Competitive salary and equity • Comprehensive medical, dental, and vision coverage • 401(k) retirement plan • Flexible vacation and time-off policy • Collaborative, fast-paced, and inclusive work environment • Opportunity to work on cutting-edge technologies with a highly cross-functional team About Lyte Lyte builds perception systems for Physical AI operating in complex environments. The company combines custom silicon, integrated sensors, and software into a unified platform for robotics, mobility, and next-generation automation. Lyte is headquartered in Sunnyvale, California, with a global presence. For more information, visit www.lyte.ai If you’re excited about building impactful technology in a dynamic, hands-on environment, we’d love to hear from you!